Overview:
LA-DCF series thermal conductive silicone grease/paste has excellent heat resistance, electrical insulation, weather resistance, hydrophobicity, physiological inertness and small surface tension, in addition, it has a low viscosity-temperature coefficient and high compression resistance Non-corrosive and non-corrosive, it is an ideal dielectric material for electronic components.
✦The above technical information and recommendations are based on what we believe to be reliable experimental data, and the performance of actual applications is directly related to surface roughness, flatness and applied pressure.
Features and Benefits:
●Thermal conductivity: 1.0～2.0W/m.k
●Non-curing, low thermal resistance
●High performance electrical insulation
●Extensive environmental adaptability
●Low cost effect
typical application:
●Computer cooling module
●LCD
●LED
● Between the graphics card and the radiator
●Network equipment & automotive electronic equipment
●High-speed memory storage module
Optional range:
LA-DCF100=thermal conductivity 1.0W/m.k
LA-DCF150=Thermal conductivity 1.5W/m.k
LA-DCF200=thermal conductivity 2.0W/m.k
Physical parameters:
| Characteristic |
Unit |
Detection method |
Test results |
| Color |
－－ |
visual inspection |
White |
| Proportion |
g/cm3 |
ASTM D792 |
≥2.0 |
| Viscosity |
CPS |
GB/T-10247 |
1000 |
| Temperature range |
℃ |
EN344 |
－40～＋200 |
| Thermal resistance |
℃－in2／w |
ASTM D5470 |
<0.23 |
| Thermal conductivity |
W/m.k |
ASTM D5470 |
1.0/1.5/2.0 |
| Fire performance |
－－ |
UL-94 |
V-0 |
Ideal dielectric material for components
✦The above technical information and recommendations are based on what we believe to be reliable experimental data, and the performance of actual applications is directly related to surface roughness, flatness and applied pressure.
