With the increasing intelligence of electronic products, especially as the core equipment of the Internet, network communication products are developing in the direction of high speed, high quality and easy management. This puts forward higher requirements for the quality of Netcom products. However, with the increase of operating frequency, working intensity and network speed, these products are faced with increasing power and heat dissipation requirements. In the thermal design of electronic products, thermal interface materials play an important role, which can improve heat dissipation efficiency, improve the operating speed, stability, reliability and service life of products.

In a router, it mainly consists of hardware such as memory, power supply, CPU, cables, CSU/DSU, vendor media, interfaces, and modules. As a medium to connect to the Internet, the router needs to provide a strong network transmission speed, but this will inevitably generate a lot of heat. If excessive heat is generated during work, it will affect the wireless signal, such as unstable signal or network disconnection. In addition, in order to save cost and space, routers are developing toward miniaturization, which increases the difficulty of heat dissipation.

Usually, the router adopts a passive cooling method, and dissipates heat through the cooling holes on the fuselage. However, the heat dissipation efficiency of only relying on the heat dissipation holes is not high. Therefore, during thermal design, engineers usually use thermally conductive silicone gaskets combined with the casing to improve the heat dissipation performance and working stability of the router.

When selecting a thermally conductive silicone gasket, it is necessary to determine the appropriate specifications, thickness, thermal conductivity and other parameters according to the components that generate heat (such as CPU, memory, and Modem modules). This ensures that the thermal silicone gasket can effectively conduct heat and distribute it to the case for better heat dissipation.

For switches, under the development of the information age, the network has become an indispensable part of life. As a common information exchange device, a switch connects servers and networks and is an important part of building a data center. With the maturity of communication technology, the exchange of information between people becomes more and more frequent, which makes the load of the switch continue to increase. As a result, switches face the challenge of balancing increased performance with reduced power consumption.

A switch is connected to multiple ports and carries a relatively large load power. During operation, the various internal modules generate a large amount of heat. If the heat accumulates inside the switch, it will cause the internal temperature to rise, thereby affecting the working performance of the switch, shortening the service life, and even causing damage to the internal electronic components. Therefore, in order to ensure the reliability and safety of the switch, the thermal design of the device is critical.

For chips that generate a lot of heat, you can choose a thermally conductive silicone gasket to fill and contact the gap between the chip surface and the shell, forming a heat conduction channel for heat transfer. In this way, the operating temperature of the chip can be controlled within a safe range, thereby ensuring the reliability and safety of the switch.

To sum up, the application of thermally conductive silicone gaskets in routers and switches and other network products plays an important role in improving heat dissipation efficiency, improving product performance and prolonging service life. By reasonably selecting the specifications and parameters of the thermally conductive silicone gasket, the heat of electronic products can be effectively managed and controlled, and its operation stability and reliability can be improved.