Overview:
LA-DS620 is a material with high thermal conductivity developed by compounding methyl vinyl silicone rubber material and thermal conductive ceramic filler in a certain proportion. It meets the requirements of heat dissipation equipment with high thermal conductivity. Low thermal resistance and good electrical insulation properties.
Features and Benefits:
Thermal conductivity: 6.0W/m.k
Self-adhesive on both sides, high fit
High Performance Electrical Insulation
Wide range of environmental adaptability
Low thermal resistance, high compression ratio
typical application:
personal laptop
LCD
led
between the graphics card and the radiator.
High speed memory storage module
Modules with high thermal conductivity requirements
Model selection:
LA-DS620-10-18
LA-DS620=Thermal conductivity 6.0W/m.k
10=Thickness 1.0mm
18=Hardness 18 degrees
Product regular size:
200*400mm
Graphic die-cutting and adhesive backing can be made according to customer requirements
Physical parameters:
| Characteristic |
Unit |
Detection method |
Test results |
| Color |
-- |
-- |
Violet |
| Thickness |
mm |
ASTM D374 |
0.3~6.0 |
| Hardness |
Shore C |
ASTM D2240 |
18/35 |
| Proportion |
g/cm3 |
ASTM D792 |
3.5 |
| Tear strength |
KN/m |
ASTM D412 |
3.1 |
| Temperature range |
℃ |
EN344 |
-40~+200 |
| Breakdown voltage |
KV |
ASTM D149 |
≥4 |
| Volume resistance |
Ω.cm |
ASTM D257 |
1.1x10 |
| Dielectric constant |
@1MHz |
ASTM D150 |
7.15 |
| Thermal conductivity |
W/m.k |
ASTM D5470 |
6.0 |
| Fire performance |
-- |
UL-94 |
V-0 |
The above technical information and recommendations are based on what we believe to be reliable experimental data. The performance of actual applications is directly related to surface roughness, flatness and applied pressure.
