LA-DS520 is developed by compounding methyl vinyl silicone rubber material and heat-conducting ceramic filler in a certain proportion, which meets the requirements of heat-dissipating equipment with high heat-conducting performance. It has very good thermal conductivity and gap filling performance, low thermal resistance, high flexibility and double-sided self-adhesiveness. It is used to fill the air gap between the heating part and the radiator or metal shell, and can effectively achieve the best heat conduction and heat dissipation. Purpose.
Model selection:
LA-DS620-10-30
LA-DS620=Thermal conductivity 6.0W/m.k
10=Thickness 1.0mm
30=hardness 30 degrees
typical application:
power module
Automotive Electronics
chip
Computer radiator
cell phone
Technical parameters:
Characteristic |
Unit |
Detection method |
Test results |
Color |
-- |
visual inspection |
dark red |
Thickness |
mm |
ASTM D374 |
0.5~6.0 |
Hardness |
Shore C |
ASTM D2240 |
30~60 |
Proportion |
g/cm3 |
ASTM D792 |
3.5±0.2 |
Tear strength |
KN/m |
ASTM D412 |
≥0.3 |
Temperature range |
℃ |
EN344 |
-40~+200 |
Breakdown voltage |
KV |
ASTM D149 |
≥4 |
The above technical information and recommendations are based on what we believe to be reliable experimental data. The performance of the actual application is directly related to the surface roughness, flatness and applied pressure.
LA-DS620 Compression stress chart
pressure psi |
10 |
20 |
30 |
40 |
50 |
Compression ratio% |
LA-DS520:1.0mm |
9 |
10 |
12 |
15 |
18 |
LA-DS520:2.0mm |
13 |
15 |
18 |
22 |
25 |
LA-DS520:3.0mm |
20 |
24 |
29 |
35 |
41 |
LA-DS520 thermal resistance and pressure chart
Pressure psi |
10 |
20 |
30 |
40 |
50 |
Thermal resistance ℃*in2/W |
LA-DS520:1.0mm |
0.544 |
0.538 |
0.500 |
0.500 |
0.478 |
LA-DS520:2.0mm |
0.723 |
0.715 |
0.692 |
0.665 |
0.636 |
LA-DS520:3.0mm |
1.069 |
1.058 |
1.023 |
0.982 |
0.925 |