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Model selection:
LA-DS250-10-30
LA-DS250=Thermal conductivity 2.5W/m.k
10=Thickness 1.0mm
30=hardness 30 degrees
Typical applications: power adapters, set-top boxes, chips, computer radiators, mobile phones
LA-DS250 is a product with good thermal conductivity and gap filling performance, electrical insulation, can work stably at -40°C~200°C, meets the flame retardant requirements of UL94V0, has good thermal conductivity and soft gap filling performance, and at the same time It can also play a role in shock absorption, insulation and sealing.
Model selection:
LA-DS250-10-30
LA-DS250=Thermal conductivity 2.5W/m.k
10=Thickness 1.0mm
30=hardness 30 degrees
typical application:
power module
Automotive Electronics
chip
Computer radiator
cell phone
Technical parameters:
| Characteristic | Unit | Detection method | Test results |
| Color | －－ | visual inspection | Grass green |
| Thickness | mm | ASTM D374 | 0.3～12 |
| Hardness | Shore C | ASTM D2240 | 20～60 |
| Proportion | g/cm3 | ASTM D792 | 2.65±0.1 |
| Tear strength | KN/m | ASTM D412 | ≥0.65 |
| Temperature range | ℃ | EN344 | －40～＋200 |
| Breakdown voltage | KV | ASTM D149 | ≥4 |
The above technical information and recommendations are based on what we believe to be reliable experimental data. The performance of the actual application is directly related to the surface roughness, flatness and applied pressure.
LA-DS250 compression stress chart
| pressure psi | 10 | 20 | 30 | 40 | 50 | |
| Compression ratio% | LA-DS250:1.0mm | 11 | 13 | 16 | 20 | 25 |
| LA-DS250:2.0mm | 16 | 20 | 25 | 32 | 39 | |
| LA-DS250:3.0mm | 23 | 29 | 36 | 42 | 50 | |
| LA-DS250:2.0mm | 16 | 20 | 25 | 32 | 39 | |
| LA-DS250:3.0mm | 23 | 29 | 36 | 42 | 50 | |
LA-DS250 thermal resistance and pressure chart
| Pressurepsi | 10 | 20 | 30 | 40 | 50 | |
| Thermal resistance ℃*in2/W | LA-DS250:1.0mm | 1.555 | 1.528 | 1.474 | 1.388 | 1.252 |
| LA-DS250:2.0mm | 1.798 | 1.767 | 1.704 | 1.605 | 1.447 | |
| LA-DS250:3.0mm | 1.962 | 1.928 | 1.859 | 1.752 | 1.579 | |
