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Model selection:
LA-DS150-10-30
LA-DS150=Thermal conductivity 1.5W/m.k
10=Thickness 1.0mm
30=hardness 30 degrees
Typical applications: power adapters, set-top boxes, chips, computer radiators, mobile phones
LA-DS150 is a high-resilience, cost-effective thermally conductive caulking gasket with good electrical insulation and thermal conductivity properties. It can work stably at -40°C~200°C and meets the flame retardant requirements of UL94V0. Its material It has a certain degree of softness and double-sided self-adhesiveness. It is used to fill the air gap between the heating part and the radiator or metal shell, and can effectively achieve the best heat conduction and heat dissipation.
Model selection:
LA-DS150-10-30
LA-DS150=Thermal conductivity 1.5W/m.k
10=Thickness 1.0mm
30=hardness 30 degrees
Typical application:
Power Adapter
set top box
chip
Computer radiator
cell phone
Technical parameters:
| Characteristic | Unit | Detection method | Test results |
| Color | －－ | visual inspection | dark gray |
| Thickness | mm | ASTM D374 | 0.3～12 |
| Hardness | Shore C | ASTM D2240 | 20～60 |
| Proportion | g/cm3 | ASTM D792 | 2.4±0.1 |
| Tear strength | KN/m | ASTM D412 | ≥0.8 |
| Temperature range | ℃ | EN344 | －40～＋200 |
The above technical information and recommendations are based on what we believe to be reliable experimental data. The performance of the actual application is directly related to the surface roughness, flatness and applied pressure.
LA-DS150 compressive stress chart
|
pressure psi |
10 | 20 | 30 | 40 | 50 | |
| Compression ratio% | LA-DS150:1.0mm | 22 | 25 | 31 | 37 | 43 |
|
|
LA-DS150:2.0mm | 26 | 30 | 34 | 39 | 45 |
|
|
LA-DS150:3.0mm | 30 | 35 | 39 | 46 | 53 |
LA-DS150 thermal resistance and pressure chart
| pressure psi | 10 | 20 | 30 | 40 | 50 | |
| Thermal resistance ℃*in2/W | LA-DS150:1.0mm | 2.013 | 1.993 | 1.935 | 1.852 | 1.770 |
| LA-DS150:2.0mm | 2.258 | 2.235 | 2.167 | 2.078 | 1.987 | |
| LA-DS150:3.0mm | 2.665 | 2.638 | 2.558 | 2.451 | 2.345 | |
